Applicability of acoustical measurements to compare crispness of wafers

Nine different brands of wafers (Manner, Napoli, Sweet Gold, Jadro, Biscoteria, Bella, Fin Carre, Fin Carre Lemon and Fin Carre Strawberry) were analysed with the 3-point bending and the cutting test by using acoustic envelop detector attached to texture analyser. Parameters; Maximum sound pressure (MSP), Total count peaks (TCP), Mean sound value (MV) and Force (F) at highest sound peak were evaluated from Acoustic amplitude-time and Force-time curves. Wafers in different quality by means of crispness were compared according to these parameters. Product Jadro has big MSP; on the other hand, it doesn’t have great values of TCP, MV or F in 3-point bending test. Product Fin Carre normal has big MSP, F and MV, but doesn’t have big values on TCP, even if there isn’t big correlation of parameters for some products, we could find on product Sweet Gold and Fin Carre Strawberry similar variations of parameters. Cutting test presented that Product Jadro had bigger values for almost all parameters. But F didn’t show big differences on products. Parameter MV had also a similar range for all products, except from product Bella. For this product, the MV is very high, whereas parameters like Maximum sound signal and total count peak is lower than those of the other products. The 3-point bending method is more suitable for acoustic emission for wafers than the cutting test since the 3-point bending method could distinguish the products better.