Comparison of acousticmechanical and sensory parameters during mechanical measurements of wafer

Original language	English
Publication status	Published - 2016

Cite this

• APA
• Author
• BIBTEX
• Harvard
• Standard
• RIS
• Vancouver

Carsanba, E. (2016). Comparison of acousticmechanical and sensory parameters during mechanical measurements of wafer.

Carsanba, Erdem. / Comparison of acousticmechanical and sensory parameters during mechanical measurements of wafer.

@conference{242bd35184d74e1ca5474540a83a905f,

title = "Comparison of acousticmechanical and sensory parameters during mechanical measurements of wafer",

author = "Erdem Carsanba",

year = "2016",

language = "English",

}

Carsanba, E 2016, 'Comparison of acousticmechanical and sensory parameters during mechanical measurements of wafer'.

Comparison of acousticmechanical and sensory parameters during mechanical measurements of wafer. / Carsanba, Erdem.
2016.

Research output: Contribution to conference › Poster › peer-review

TY - CONF

T1 - Comparison of acousticmechanical and sensory parameters during mechanical measurements of wafer

AU - Carsanba, Erdem

PY - 2016

Y1 - 2016

M3 - Poster

ER -

Carsanba E. Comparison of acousticmechanical and sensory parameters during mechanical measurements of wafer. 2016.