Comparison of acousticmechanical and sensory parameters during mechanical measurements of wafer

Research output: Contribution to conference › Poster › peer-review

Original language	English
Pages	1-1
Number of pages	1
Publication status	Published - 2016
Externally published	Yes
Event	4th ISEKI Food Conference - Vienna, Austria Duration: 6 Jul 2016 → 8 Jul 2016 https://eu-refresh.org/isekifood-2016-4th-iseki-food-conference.html

Conference	4th ISEKI Food Conference
Abbreviated title	ISEKI_Food 2016
Country/Territory	Austria
City	Vienna
Period	6/07/16 → 8/07/16
Internet address	https://eu-refresh.org/isekifood-2016-4th-iseki-food-conference.html

Cite this

@conference{242bd35184d74e1ca5474540a83a905f,

title = "Comparison of acousticmechanical and sensory parameters during mechanical measurements of wafer",

author = "Erdem Carsanba and Klaus Duerrschmid and Gerhard Schiefer",

year = "2016",

language = "English",

pages = "1--1",

note = "4th ISEKI Food Conference, ISEKI\_Food 2016 ; Conference date: 06-07-2016 Through 08-07-2016",

url = "https://eu-refresh.org/isekifood-2016-4th-iseki-food-conference.html",

}